Highly thermally conductive silicone composition and cured product thereof
AssigneeShin-Etsu Chemical Co., Ltd.
InventorMitsuhiro IWATA
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AssigneeShin-Etsu Chemical Co., Ltd.
InventorMitsuhiro IWATA
Estimating the term…
A highly thermally conductive silicone composition containing, an organopolysiloxane, spherical magnesium oxide powder with sphericity of 0.8 or more, particle size of 80-150 μm, and a purity of 98% by mass or more, thermally conductive filler including (C-I) spherical aluminum oxide powder with sphericity of 0.8 or more and particle size of 7-60 μm, proportion of coarse particles of 96-150 μm being 0.1-30% by mass of an entirety of component (C-I) and (C-II) spherical or irregularly shaped aluminum oxide powder with particle size of 0.1-4 μm, and a volume ratio between (C-I) and (C-II) of 2:8-8:2, and (D) cation exchange and/or amphoteric ion exchange type ion-trapping agent, at least one element selected from Zr, Bi, Sb, Mg, and Al being supported on the ion-trapping agent, silicone composition having thermal conductivity of 7.0 W/m·K or more and viscosity of 30-800 Pa·s.
1-7. (canceled)
A highly thermally conductive silicone composition comprising:
Dependencies are inferred from the claim text.