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US 2026/0217965 A1Published application
Curable resin composition
AssigneeThreebond Co., Ltd.
InventorYosuke WATANABE
Life of this patent
Estimating the term…
Abstract
A curable resin composition can be cured at normal temperature without use of any heat or light source, and a cured product thereof has excellent high compression resistance and sealability. A curable resin composition contains component (A): a compound having two or more epoxy groups; component (B): a thiol curing agent; component (C): hollow resin particles; and component (D): a curing accelerator.
Claims10
A curable resin composition comprising the following components (A) to (D):
- component (A):
- a compound having two or more epoxy groups
- component (B):
- a thiol curing agent
- component (C):
- hollow resin particles
- component (D):
- a curing accelerator.
5 more elements
Dependencies are inferred from the claim text.