Polyurethane resin for polishing pads, and polishing pad
AssigneeSanyo Chemical Industries, Ltd.
InventorsAtsushi WAKATSUKI, Kenta KUCHIDA, Miki IIMURO, Masafumi SAWADA
Life of this patent
Estimating the term…
Abstract
Provided is a polyurethane resin (U) for a polishing pad, containing, as constituent monomers: at least one polyol (a) selected from the group consisting of a polyether polyol (a11), a polyester polyol (a12), and a polycarbonate polyol (a13); a polyisocyanate (b); and a compound (c) having an ionic group and two active hydrogen atoms, the polyurethane resin (U) for a polishing pad containing, among constituent components thereof, an active hydrogen atom-containing component (A′) having an HLB of 8.0 or higher in an amount of 80 to 100% by weight based on a weight of an active hydrogen atom-containing component (A).
Claims3
A polyurethane resin (U) for a polishing pad, comprising, as constituent monomers:
- at least one polyol (a) selected from the group consisting of a polyether polyol (a11), a polyester polyol (a12), and a polycarbonate polyol (a13);
- a polyisocyanate (b);
- and
- a compound (c) having an ionic group and two active hydrogen atoms,
- the polyurethane resin (U) for a polishing pad containing, among constituent components thereof, an active hydrogen atom-containing component (A′) having an HLB of 8.0 or higher in an amount of 80 to 100% by weight based on a weight of an active hydrogen atom-containing component (A).
Dependencies are inferred from the claim text.