Cooling air device for substrate glass forming by overflow process and method thereof

A cooling air device for substrate glass forming by an overflow process, comprising:

• two homogenization boxes disposed at a bottom of an overflow brick, and a cooling mechanism, wherein:
• the two homogenization boxes are respectively located at two sides of a substrate glass;
• the cooling mechanism comprises a plurality of cooling units, which are respectively disposed on the two homogenization boxes, each of the plurality of cooling units comprises a first cooling air tube, a second cooling air tube, and a fixing assembly;
• the first cooling air tube is disposed outside a corresponding homogenization box, and an air inlet of the first cooling air tube is configured to be in communication with a cooling air generation mechanism;
• the second cooling air tube is inserted into an interior of a corresponding homogenization box, an air outlet of the second cooling air tube is disposed facing the substrate glass, and the second cooling air tube is made of a high-temperature-resistant material;
• and
• the first cooling air tube and the second cooling air tube are in communication with each other through the fixing assembly.