High-strength graphene heat-conducting pad and preparation method therefor
AssigneeShenzhen Hfc Co., Ltd.
InventorsYong CAO, Shangqiang YANG, Aixiang SUN, Xiao FANG, Hongping WANG
Life of this patent
Estimating the term…
Loading patent…
AssigneeShenzhen Hfc Co., Ltd.
InventorsYong CAO, Shangqiang YANG, Aixiang SUN, Xiao FANG, Hongping WANG
Estimating the term…
Disclosed are a high-strength graphene heat-conducting pad and a preparation method therefor. The high-strength graphene heat-conducting pad includes at least two graphene heat-conducting layers stacked in sequence, wherein adjacent graphene heat-conducting layers are fixedly adhered by means of an adhesive; the graphene heat-conducting layers include a plurality of layers of graphene films stacked in sequence; adjacent graphene films are adhered by means of an adhesive; and the stacking directions of the graphene films of two adjacent graphene heat-conducting layers are perpendicular to each other and parallel to the same plane, and the stacking directions of the graphene heat-conducting layers are perpendicular to the stacking directions of the graphene films in any graphene heat-conducting layer.
A high-strength graphene heat-conducting pad, comprising at least two graphene heat-conducting layers stacked in sequence, wherein adjacent graphene heat-conducting layers are fixedly adhered by an adhesive;
Dependencies are inferred from the claim text.