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US 2026/0215329 A1Published application
Surface-cured acid anhydride epoxies
AssigneeTexas Instruments Incorporated
InventorsYing-Chang CHEN, Jane Qian LIU
Life of this patent
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Abstract
In examples, an electronic device includes a semiconductor die; a bond pad coupled to the semiconductor die; a bond wire coupled to the bond pad; and an acid anhydride material covering the bond wire and having a physicochemical property that varies by less than 1% throughout a volume of the acid anhydride material relative to a reference measurement of the physicochemical property in the acid anhydride material.
Claims20
An electronic device, comprising:
- a semiconductor die;
- a bond pad coupled to the semiconductor die;
- a bond wire coupled to the bond pad;
- and
- an acid anhydride material covering the bond wire and having a physicochemical property that varies by less than 1% throughout a volume of the acid anhydride material relative to a reference measurement of the physicochemical property in the acid anhydride material.
2 more elements
An electronic device, comprising:
- a semiconductor die including circuitry;
- a microelectromechanical systems (MEMS) device over the semiconductor die and coupled to the circuitry;
- a bond pad over the semiconductor die and coupled to the circuitry;
- a bondline on the semiconductor die between the MEMS device and the bond pad, the bondline circumscribing the MEMS device ;
- a cap over the bondline and over the MEMS device ;
- a bond wire coupled to the bond pad;
- and
- an acid anhydride material covering the bond wire and having a physicochemical property that is consistent throughout a volume of the acid anhydride material.
5 more elements
A method for manufacturing an electronic device, comprising:
- dispensing an acid anhydride material on a bond wire, the bond wire coupled to a semiconductor die via a bond pad;
- applying heat to the acid anhydride material by a halogen heating lamp;
- and
- curing the acid anhydride material after the application of the heat.
1 more element
Dependencies are inferred from the claim text.