Semiconductor chip and semiconductor package including the same

A semiconductor package comprising:

• a package substrate including a plurality of substrate pads;
• a first semiconductor chip on the package substrate;
• and
• a second semiconductor chip on the first semiconductor chip,
• wherein the first semiconductor chip includes:
• a plurality of first pads;
• a first functional circuit configured to operate based on a first signal that is received from a first substrate pad of the plurality of substrate pads through a first pad of the plurality of first pads;
• a plurality of first fuses between the first functional circuit and the plurality of first pads;
• and
• a first demultiplexer configured to apply a first voltage to at least one of the plurality of first fuses based on a first control signal,
• wherein the first pad of the plurality of first pads is configured to be electrically connected to the first functional circuit through a first fuse of the plurality of first fuses, and
• wherein remaining first pads of the plurality of first pads other than the first pad of the plurality of first pads are configured to be electrically disconnected from the first functional circuit by remaining first fuses of the plurality of first fuses other than the first fuse of the plurality of first fuses.

A semiconductor package comprising:

• a package substrate including a plurality of substrate pads;
• a first semiconductor chip on the package substrate, the first semiconductor chip including:
• a plurality of first pads;
• a first functional circuit;
• a plurality of first fuses between the first functional circuit and the plurality of first pads;
• and
• a first demultiplexer configured to apply a first voltage to at least one of the plurality of first fuses based on a first control signal;
• and
• a second semiconductor chip on the first semiconductor chip, the second semiconductor chip including:
• a plurality of second pads;
• a second functional circuit;
• a plurality of second fuses between the second functional circuit and the plurality of second pads;
• and
• a second demultiplexer configured to apply the first voltage to at least one of the plurality of second fuses based on a second control signal,
• wherein the first functional circuit is configured to operate (i) based on a first signal that is received from a first substrate pad of the plurality of substrate pads through a first one of the plurality of first pads, and (ii) based on a second signal that is received from a second substrate pad of the plurality of substrate pads through a second one of the plurality of first pads,
• wherein the first one of the plurality of first pads and the second one of the plurality of first pads are configured to be electrically connected to the first functional circuit respectively through two of the plurality of first fuses,
• wherein the second functional circuit is configured to operate (i) based on the first signal that is received from the first substrate pad through a first one of the plurality of second pads, and (ii) based on a third signal that is received from a third substrate pad of the plurality of substrate pads through a second one of the plurality of second pads,
• wherein the first one of the plurality of second pads and the second one of the plurality of second pads are configured to be electrically connected to the second functional circuit respectively through two of the plurality of second fuses,
• wherein a first position in the first semiconductor chip and a second position in the second semiconductor chip are overlapped,
• wherein the first position is a position of the first one of the plurality of first pads,
• wherein the second position is a position of the first one of the plurality of second pads,
• wherein a third position in the first semiconductor chip and a fourth position in the second semiconductor chip are in different positions,
• wherein the third position is a position of the second one of the plurality of first pads, and
• wherein the fourth position is a position of the second one of the plurality of second pads.