Substrate treating apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsJae Uk SIM, Kazuya ONO, Byeong Tak PARK, Kyung Bin BAE, Seung Hoo LEE, Un KIM, Si Woong WOO
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Abstract
A substrate treating apparatus including a deformation chuck capable of compensating for an asymmetric scale is provided. The substrate treating apparatus comprising: a first bonding chuck supporting a first substrate; and a second bonding chuck facing the first bonding chuck and supporting a second substrate, wherein the second bonding chuck includes a second stage fixing the second substrate, and the second stage is deformed based on a moment applied along an edge region thereof.
Claims20
A substrate treating apparatus comprising:
- a first bonding chuck supporting a first substrate;
- and
- a second bonding chuck facing the first bonding chuck and supporting a second substrate,
- wherein the second bonding chuck includes a second stage fixing the second substrate, and
- wherein the second stage is deformed based on a moment applied along an edge region thereof.
A substrate treating apparatus comprising:
- a first bonding chuck supporting a first substrate;
- and
- a second bonding chuck facing the first bonding chuck and supporting the second substrate,
- wherein the second bonding chuck includes:
- a second stage fixing the second substrate;
- a plurality of moment levers coupled to the second stage along an edge region of the second stage;
- and
- a plurality of flexures individually coupled to the moment levers,
- wherein the edge region of the second stage includes a plurality of portions, and
- wherein the second stage is symmetrically deformed based on a moment applied along each portion.
A substrate treating apparatus comprising:
- a first bonding chuck supporting a first substrate;
- and
- a second bonding chuck facing the first bonding chuck and supporting a second substrate,
- wherein the second bonding chuck includes:
- a second stage fixing the second substrate;
- a plurality of moment levers coupled to the second stage along an edge region of the second stage;
- and
- a plurality of flexures individually coupled to the moment levers,
- wherein the edge region of the second stage includes a plurality of portions, and
- wherein the second stage is asymmetrically deformed based on a pattern scale formed in the second substrate or a moment differentially applied depending on warpage generated in the second substrate.
Dependencies are inferred from the claim text.