Compression-molding device and compression-molding method
AssigneeApic Yamada Corporation
InventorsMasaaki WAKUI, Takashi Saito, Makoto KAWAGUCHI, Yudai NOMURA
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Abstract
Provided are a compression-molding device and a compression-molding method. The compression-molding device includes: an upper mold having a cavity; a lower mold having a workpiece-holding part; and a conveyor that places a sealing resin on top of a workpiece held in the workpiece-holding part, or holds a workpiece with a sealing resin placed thereon in the workpiece-holding part. As the sealing resin, a solid or semi-solid resin having a given shape whose overall shape corresponds to a shape of the workpiece is configured.
Claims8
A compression-molding device for processing a workpiece into a molded product by sealing it with a sealing resin by using a sealing mold including an upper mold having a cavity and a lower mold having a workpiece-holding part, the compression-molding device comprising:
- a conveyor that places the sealing resin on top of the workpiece held in the workpiece-holding part, or holds the workpiece with the sealing resin placed thereon in the workpiece-holding part,
- wherein as the sealing resin, a solid or semi-solid resin having a given shape whose overall shape corresponds to a shape of the workpiece is configured.
A compression-molding method for processing a workpiece into a molded product by sealing it with a sealing resin by using a sealing mold including an upper mold having a cavity and a lower mold having a workpiece-holding part, the method comprising:
- a resin preparation step of preparing, as the sealing resin, a solid or semi-solid resin having a given shape whose overall shape corresponds to a shape of the workpiece;
- a workpiece holding step of holding the workpiece in the workpiece-holding part;
- and
- a resin placement step of placing the sealing resin on top of the workpiece after or before the workpiece holding step.
Dependencies are inferred from the claim text.