Back to results
US 2026/0214824 A1Published application
Housing
AssigneesAsahi Denso Co., Ltd., Kubota Corporation
InventorsNaoki MIZUNO, Keisuke MIURA, Hiroyuki ANAMI
Life of this patent
Estimating the term…
Abstract
A housing includes a case body to house an electronic substrate, a lid body attachable to the case body, and a seal provided between the case body and the lid body. The seal includes a first seal portion to contact the electronic substrate, and a second seal portion located outward of the electronic substrate.
Claims10
A housing comprising:
- a case body to house an electronic substrate;
- a lid body attachable to the case body;
- and
- a seal provided between the case body and the lid body;
- wherein the seal includes:
- a first seal portion to contact the electronic substrate;
- and
- a second seal portion located outward of the electronic substrate.
5 more elements
Dependencies are inferred from the claim text.