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US 2026/0214809 A1Published application
Photonic integrated circuit embedded substrate and photonic integrated circuit package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKwang Yun KIM, Kyung Sang Lim, Seung Eun Lee, Yong Hoon Kim
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Abstract
A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.
Claims10
A substrate comprising:
- a photonic integrated circuit disposed in the substrate and spaced apart from an upper surface and a lower surface of the substrate which oppose each other in a thickness direction of the substrate;
- a first opening, as an optical path, extending from the lower surface of the substrate to expose a portion of the photonic integrated circuit;
- an electrical path extending from the upper surface of the substrate to connect to the photonic integrated circuit, and overlapping the photonic integrated circuit in the thickness direction;
- and
- a first cover insulating layer, as a lowermost insulating layer of the substrate, having a plurality of second openings to respectively expose first pads of one of wiring layers of the substrate.
2 more elements
Dependencies are inferred from the claim text.