Power module comprising pcb having deformation sensing elements for monitoring mechanical fatigue of power modules packaging

Abstract

Power module comprising a PCB comprising at least two outer layers provided with metallic tracks, comprising a core layer embedding one or more power semiconductor dies and comprising one or more deformation sensing elements embedded in said PCB to sense a mechanical stress in at least one axis in a three dimension coordinate system attached to the PCB. Process for measuring stress on such a power module PCB comprising an initial measurement of a deformation Do of the PCB in use during a calibration period with said strain gauges to provide a calibration of an initial deformation range of said PCB, in use measurements of deformation cycles Cy of said PCB and counting of said deformation cycles, repeating (150) said in use measurements during operation of said power module.

Dependencies are inferred from the claim text.