Interdigital transducer capacitor with support pillar
AssigneeSkyworks Solutions, Inc.
InventorsRei Goto, Shoji Okamoto
Life of this patent
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Abstract
A packaged acoustic wave device is disclosed. Ther packaged acoustic wave device can include an interdigital transducer capacitor, a support pillar over the interdigital transducer capacitor, and a packaging roof structure coupled to the support pillar. The support pillar can include an insulating material. The packaged acoustic wave device can include a signal line over the insulating material. The signal line can be electrically coupled to a signal terminal of an acoustic wave device. The support pillar or insulating material can increase capacitance while reducing lateral dimensions of the packaged acoustic wave device.
Claims20
A packaged acoustic wave device comprising:
- an interdigital transducer capacitor;
- a support pillar over the interdigital transducer capacitor, the support pillar including an insulating material;
- and
- a packaging roof structure coupled to the support pillar.
A packaged filter comprising:
- a multi-layer piezoelectric substrate including a support substrate and a piezoelectric layer over the support substrate, the multi-layer piezoelectric substrate having a first region and a second region;
- an interdigital transducer capacitor in the first region;
- an acoustic wave device in the second region;
- a support pillar over the interdigital transducer capacitor, the support pillar including an insulating material;
- and
- a packaging roof structure coupled to the multi-layer piezoelectric substrate via a seal ring and the support pillar.
A packaged interdigital transducer capacitor comprising:
- a piezoelectric layer;
- a support pillar including an insulating material;
- an interdigital transducer electrode between the piezoelectric layer and the support pillar;
- and
- a packaging roof structure coupled to the support pillar.
Dependencies are inferred from the claim text.