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US 2026/0213397 A1Published application
Antenna-in-package module
AssigneeLG Innotek Co., Ltd.
InventorByung Hyun CHOI
Life of this patent
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Abstract
An antenna-in-package (AiP) module according to one embodiment of the present invention comprises a substrate, a first chipset embedded in the substrate, a second chipset disposed on the substrate, and a radiating unit electrically connected to the second chipset, wherein the radiating unit is shaped as a cover that covers the substrate.
Claims21
1-10. (canceled)
An AiP Antenna in Package module comprising:
- a substrate;
- a first chipset embedded in the substrate;
- a second chipset disposed on the substrate;
- and
- a radiating unit electrically connected to the second chipset,
- wherein the radiating unit is shaped as a cover that covers the substrate.
3 more elements
A battery management system comprising:
- a battery pack comprising a battery cell;
- a first module mounted on the battery pack to control operation of the battery cell and communicate with a battery control unit;
- and
- a battery control unit configured to control the battery cell through communication with the first module,
- wherein the first module comprises:
- a substrate;
- a first chipset embedded in the substrate;
- a second chipset disposed on the substrate;
- and
- a radiating unit electrically connected to the second chipset, and
- wherein the radiating unit is shaped as a cover that covers the substrate.
8 more elements
Dependencies are inferred from the claim text.