Charge trapping nor flash memory for stacked memory architectures
AssigneeMicron Technology, Inc.
InventorsInnocenzo Tortorelli, Agostino Pirovano, Lorenzo Fratin, Fabio Pellizzer
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorsInnocenzo Tortorelli, Agostino Pirovano, Lorenzo Fratin, Fabio Pellizzer
Estimating the term…
Methods, systems, and devices for charge trapping not-OR (NOR) flash memory for stacked memory architectures are described. A memory device may include one or more three-dimensional (3D) charge trapping NOR flash memory dies in a stack of memory dies. In some examples, the stack of memory dies may also include one or more volatile memory dies, while in other examples the stack of memory dies may primarily include charge trapping NOR memory dies. The stack of memory dies may also include a logic die configured to access each of the memory dies of the stack using one or more vias, channels, or other components associated with the stack. In some examples, the logic die may access the memory dies of the stack in response to an access command received from a graphics processing unit (GPU) or other processing circuitry of the memory device.
A memory system, comprising:
A memory system, comprising:
A method for operating a memory system, comprising:
Dependencies are inferred from the claim text.