Method of setting up a projection exposure system, a projection exposure method and a projection exposure system for microlithography

A method of setting up a projection exposure system for exposing a radiation sensitive substrate with at least one image of a pattern, the projection exposure system comprising:

• an illumination system configured to generate illumination radiation directed onto the pattern in an illumination field;
• a projection lens comprising a plurality of optical elements configured to project a part of the pattern lying in the illumination field onto an image field at the substrate with projection radiation,
• a measuring system capable of measuring at least one property of the projection radiation representing an aberration level at a plurality of spaced apart measuring points distributed in the image field;
• and
• an operating control system comprising at least one manipulator operatively connected to an optical element of the projection exposure system to modify imaging properties of the projection exposure system based on measurement results generated by the measuring system;
• the method comprising:
• determining, in a measuring point distribution calculation, a measuring point distribution defining a number and positions of measuring points to be used in a measurement, and
• performing the measuring point distribution calculation under boundary conditions representing at least:
• (i) manipulation capacities of the operating control system;
• (ii) measuring capacities of the measuring system;
• and
• (iii) material properties used for manufacturing optical elements of an individual projection lens and measured or modelled prior to assembling the projection lens.