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US 2026/0211197 A1Published application
Optical module and packaging method
AssigneeCloud Intelligence Assets Holding (Singapore) Private Limited
InventorsYun BAO, Anbin WANG, Chongjin XIE
Life of this patent
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Abstract
Embodiments of the present disclosure provide an optical module and a packaging method. In the optical module, a cover is above the optical system, and a sealant is between the cover and the optical system, such that the groove of the optical system can form a sealed air cavity. A sealant is between the optical module and the multi-channel optical fiber interface. In addition, a sealant is between the optical system and the circuit board.
Claims12
An optical module comprises:
- an optical system, a circuit board, a multi-channel optical fiber interface, and a cover;
- wherein an upper surface of the optical system is provided with a groove for accommodating an air medium required for light path propagation;
- and a side surface of the optical system, perpendicular to a light exit direction, is provided with a first optical fiber port;
- the cover covers an upper surface of the optical system, and a contact position between the cover and the upper surface of the optical system is provided with a first sealant to form a sealed air cavity between the cover and the groove;
- the multi-channel optical fiber interface is mounted at the first optical fiber port, and a contact position between the multi-channel optical fiber interface and the first optical fiber port is provided with a second sealant to hermetically connect the multi-channel optical fiber interface with the first optical fiber port;
- and
- a bottom of the optical system is mounted on the circuit board, and the optical system is coupled to an optical component on the circuit board, and a contact position between a lower surface of the optical system and the circuit board is provided with a third sealant to hermetically connect the optical system with the circuit board.
4 more elements
A method of packaging an optical module, comprising:
- determining an optical system to be packaged, wherein an upper surface of the optical system is provided with a groove for accommodating an air medium required for light path propagation, and a side surface of the optical system, perpendicular to a light exit direction, is provided with a first optical fiber port;
- mounting a multi-channel optical fiber interface at the first optical fiber port, and coupling the optical system mounted with the multi-channel optical fiber interface to an optical component on a circuit board;
- covering a cover above an upper surface of the optical system, and performing sealing connection on a contact position between the upper surface of the optical system and the cover by using a sealant to form an air cavity between the cover and the groove;
- and
- performing sealing connection between the multi-channel optical fiber interface and the first optical fiber port by using a sealant, and performing sealing connection between a lower surface of the optical system and the circuit board by using a sealant.
2 more elements
Dependencies are inferred from the claim text.