# US 2026/0209983 A1 · Electroplating apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0209983 A1 - Document ID: US20260209983A1 - Status: Published application - Kind: A1 - Application number: 19/267,157 - Filed: 2025-07-11 - Published: 2026-07-23 - Earliest claimed: 2025-01-23 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: SEUNGA CHOI; SUNGKEUN LEE - Web page: https://patentgrep.com/patent/US20260209983A1 ## CPC - C25D 17/06: Suspending or supporting devices for articles to be coated - C25D 7/12: Semiconductors - C25D 17/001: {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells} - C25D 17/004: {Sealing devices} - C25D 17/02: Tanks; Installations therefor - C25D 3/38: of copper - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR ## Abstract An electroplating apparatus including a plating bath containing a plating solution, and a substrate holder holding a substrate so as to immerse the substrate in the plating solution. The substrate holder includes a rotor supporting the substrate, a moving plate supporting the rotor, a support plate under the moving plate, at least three cylinders coupled to the support plate, each cylinder having a piston connected to a lower surface of the moving plate to move the moving plate up and down, shafts between the cylinders, coupled to an upper surface of the support plate, and extending in a direction vertical to the upper surface of the support plate, linear bushings coupled to a lower surface of the moving plate and corresponding to the shafts, and a sealing ring fixing the substrate onto the rotor. The shafts are inserted into guide holes vertically penetrating the moving plate and the linear bushings. ## Claims ### Claim 1 An electroplating apparatus comprising: a plating bath in which a plating solution is contained; and a substrate holder configured to hold a substrate so as to immerse the substrate in the plating solution, wherein the substrate holder includes: a rotor configured to support the substrate; a moving plate configured to support the rotor thereunder; a support plate disposed under the moving plate; at least three cylinders coupled to the support plate, each of the cylinders having a piston connected to a lower surface of the moving plate to move the moving plate up and down; shafts disposed between the cylinders, and coupled to an upper surface of the support plate so as to extend in a direction vertical to the upper surface of the support plate; linear bushings coupled to a lower surface of the moving plate so as to vertically correspond to the shafts; and a sealing ring configured to fix the substrate onto the rotor by pressing an upper surface of the substrate when the moving plate is raised by the cylinders, and wherein the shafts are inserted into guide holes vertically penetrating the moving plate and the linear bushings. ### Claim 2 (depends on 1) The electroplating apparatus of claim 1, wherein the moving plate has a planar shape of a circular ring, wherein the pistons are arranged along an edge of the moving plate, and wherein the shafts are arranged along the edge of the moving plate. ### Claim 3 (depends on 2) The electroplating apparatus of claim 2, wherein the pistons and the shafts are alternately disposed along the edge of the moving plate. ### Claim 4 (depends on 1) The electroplating apparatus of claim 1, wherein when the moving plate is lowered by the cylinders, the shafts protrude onto the moving plate. ### Claim 5 (depends on 1) The electroplating apparatus of claim 1, further comprising: fixing blocks configured to fix the shafts to the support plate, wherein the fixing blocks have a recessed portion formed from upper surfaces of the fixing blocks inward, and surrounding the shafts, and wherein, when the moving plate is lowered by the cylinders, the linear bushings are inserted into the recessed portion of the fixing blocks. ### Claim 6 (depends on 5) The electroplating apparatus of claim 5, wherein upper surfaces of the fixing blocks are located at the same level as or at a lower level than the upper surface of the support plate. ### Claim 7 (depends on 5) The electroplating apparatus of claim 5, wherein when the moving plate is lowered by the cylinders, the lower surface of the moving plate is in contact with the upper surface of the support plate. ### Claim 8 (depends on 1) The electroplating apparatus of claim 1, wherein vertical axes of the shafts are parallel to a moving direction of the pistons. ### Claim 9 (depends on 1) The electroplating apparatus of claim 1, wherein a width of the guide holes is greater than a width of the shafts. ### Claim 10 (depends on 1) The electroplating apparatus of claim 1, wherein when the moving plate is lowered by the cylinders, an uppermost end of the shafts is located at a lower vertical level than the substrate. ### Claim 11 (depends on 1) The electroplating apparatus of claim 1, wherein a width of the guide holes measured in the moving plate is greater than a width of the guide holes measured in the linear bushings. ### Claim 12 (depends on 1) The electroplating apparatus of claim 1, wherein a height of the linear bushings is greater than a vertical thickness of the moving plate. ### Claim 13 (depends on 1) The electroplating apparatus of claim 1, wherein when the moving plate is raised and lowered by the cylinders, the moving plate moves to upper portions or lower portions of the shafts along the guide holes. ### Claim 14 An electroplating apparatus comprising: a support plate; a moving plate disposed on the support plate; a cylinder coupled to the support plate, and having a piston connected to a lower surface of the moving plate to move the moving plate up and down; a fixing block coupled to the support plate so as to be horizontally spaced apart from the cylinder; a shaft coupled to the fixing block, and extending from the support plate toward the moving plate, a vertical axis of the shaft being parallel to a moving direction of the piston; a linear bushing coupled to a lower surface of the moving plate; and a guide hole vertically penetrating the moving plate and the linear bushing, wherein the shaft is inserted into the guide hole, wherein the fixing block has a recessed portion formed from an upper surface of the fixing block inward, and surrounding the shaft, and wherein, when the moving plate is lowered by the cylinder, the linear bushing is inserted into the recessed portion of the fixing block. ### Claim 15 (depends on 14) The electroplating apparatus of claim 14, wherein the moving plate has a planar shape of a circular ring, wherein each of the cylinder and the piston is provided in a plurality equal to or more than three, and the cylinders and the pistons are arranged along an edge of the moving plate, and wherein the shaft is provided in a plurality equal to or more than three, and the shafts are arranged along the edge of the moving plate. ### Claim 16 (depends on 15) The electroplating apparatus of claim 15, wherein the pistons and the shafts are alternately disposed along the edge of the moving plate. ### Claim 17 (depends on 14) The electroplating apparatus of claim 14, wherein when the moving plate is lowered by the cylinder, the shaft protrudes onto the moving plate. ### Claim 18 (depends on 14) The electroplating apparatus of claim 14, wherein when the moving plate is raised and lowered by the cylinder, the moving plate moves to an upper portion or a lower portion of the shaft along the guide hole. ### Claim 19 (depends on 14) The electroplating apparatus of claim 14, wherein when the moving plate is lowered by the cylinder, the lower surface of the moving plate is in contact with the upper surface of the support plate. ### Claim 20 An electroplating apparatus comprising: a plating bath in which a plating solution is contained; and a substrate holder configured to hold a substrate so as to immerse the substrate in the plating solution, wherein the substrate holder includes: a moving plate; a support plate disposed under the moving plate; a cylinder coupled to the support plate, and having a piston connected to a lower surface of the moving plate to move the moving plate up and down; fixing blocks coupled to the support plate so as to be horizontally spaced apart from the cylinder; at least three shafts coupled to the fixing blocks, and coupled to an upper surface of the support plate so as to extend in a direction vertical to the upper surface of the support plate; and linear bushings coupled to a lower surface of the moving plate so as to vertically correspond to the shafts, wherein the shafts vertically penetrate the moving plate and the linear bushings, wherein the moving plate has a planar shape of a circular ring, and wherein the shafts are arranged along an edge of the moving plate.