Method for manufacturing semiconductor substrate, method for manufacturing processed semiconductor substrate, and release composition

A processed semiconductor substrate production method comprising:

• producing a laminate having a semiconductor substrate, a support substrate, and an adhesive layer formed from an adhesive composition;
• processing the semiconductor substrate of the produced laminate;
• separating the semiconductor substrate and the adhesive layer from the support substrate;
• and
• removing the adhesive layer on the semiconductor substrate by use of a remover composition, wherein:
• the remover composition contains a solvent but no salt;
• and
• the solvent comprises a C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound.