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US 2026/0209581 A1Published application
Adhesive composition, cured body, and adhesive for electronic devices
AssigneeSekisui Chemical Co., Ltd.
InventorsTomokazu TAMAGAWA, Takumi KIDA, Kouhei HAGIWARA, Yuusuke GOTOU, Akira YUUKI
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Abstract
An adhesive composition, comprising a moisture-curable urethane resin (A) that is a reaction product of a polyol (a1) having a polytrimethylene glycol skeleton and a polyfunctional isocyanate (a2).
Claims7
An adhesive composition, comprising a moisture-curable urethane resin (A) that is a reaction product of a polyol (a1) having a polytrimethylene glycol skeleton and a polyfunctional isocyanate (a2).
Dependencies are inferred from the claim text.