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US 2026/0209443 A1Published application
Thermally Conductive Silicone Adhesive
AssigneeHenkel AG & Co. KGaA
InventorsJianfeng Zhang, Qizhuo Zhuo, Jay Chao, Sreevalli Bokka
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Abstract
A thermally conductive silicone adhesive that exhibits both high thermal conductivity and high adhesion strength which is prepared from a curable composition including reactable organosiloxanes and thermally conductive particulate filler and is useful in dissipating excess thermal energy in electronic packages.
Claims24
A curable composition for preparing a thermally conductive adhesive, the curable composition comprising:
- an organosiloxane preparation including:
- (i) a first reactive organosiloxane having at least one unsaturated group;
- and
- (ii) a second reactive organosiloxane including at least about one silicon hydride functional group and at least about one alkenyl group;
- an organosiloxane including an average of at least two silicon-bonded hydrogen atoms per molecule, the organosiloxane being present in an amount effective to cure the composition;
- and
- thermally conductive particulate filler, wherein the thermally conductive adhesive exhibits a thermal conductivity of at least 3 W/m*K and an adhesion strength of at least 3 MPa.
4 more elements
A thermally conductive adhesive comprising the reaction product of:
- (A) an organosiloxane preparation including:
- (i) a first reactive organosiloxane having at least one reactive unsaturated group;
- and
- (ii) a second reactive organosiloxane including at least about one silicon hydride functional group and at least about one alkenyl group;
- and
- (B) an organosiloxane including an average of at least two silicon-bonded hydrogen atoms per molecule,
- wherein at least one of Components (A) and (B) include thermally conductive particulate filler, such that the thermally conductive adhesive exhibits a thermal conductivity of at least 3 W/m*K and an adhesion strength of at least 3 MPa.
4 more elements
A method for making a package, the method comprising:
- (a) providing a composition, comprising:
- (i) a first part, including a first reactive organosiloxane including an average of at least about one alkenyl groups per molecule, and a second reactive organosiloxane including at least about one silicon hydride functional group and at least about one alkenyl group;
- (ii) a second part, including an unsaturated organosiloxane;
- and
- (iii) thermally conductive particulate filler in at least one of the first part and the second part;
- (b) dispensing the composition to a surface of at least one of a heat dissipater and an electronic component;
- (c) optionally in the presence of a catalytic amount of a catalyst, reacting the first part with the second part;
- and
- (d) securing the electronic component to the heat dissipater with the composition disposed along a thermal dissipation pathway from the electronic component.
6 more elements
Dependencies are inferred from the claim text.