Resin composition and product of the same
AssigneeElite Electronic Material (Zhongshan) Co., Ltd.
InventorsChangyuan LI, Teng XU, Xiang XIONG, Hezong ZHANG
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AssigneeElite Electronic Material (Zhongshan) Co., Ltd.
InventorsChangyuan LI, Teng XU, Xiang XIONG, Hezong ZHANG
Estimating the term…
Disclosed is a resin composition, including 100 parts by weight of a maleimide resin and 10 to 100 parts by weight of a compound of formula (1). Wherein, n is an integer from 3 to 6, X and Y are each independently arylcyclobutenoxy or aryloxy, the number of arylcyclobutenoxy is greater than or equal to 3, and the aryloxy contains or does not contain an alkenyl, an acrylate group or a methacrylate group having 1 to 4 carbon atoms. Further disclosed is a use of the resin composition in preparing a product, and a product of which at least a portion is prepared from the resin composition, wherein the product includes a prepreg, a resin film, a laminate, a printed circuit board, or a cured insulator.
A resin composition, characterized by comprising 100 parts by weight of a maleimide resin and 10 to 100 parts by weight of a compound of formula (1),
Dependencies are inferred from the claim text.