Indium foil processing method and indium foil processing machine

An indium foil processing machine, comprising:

• a platform having at least one working area and at least one feeding area;
• at least one feeding device disposed in the at least one feeding area and configured to supply a plurality of indium foils;
• a delivery device disposed in the at least one working area and configured to deliver a plurality of substrates along a direction;
• at least one placement head disposed on the platform and movably along an X axis, a Y axis, and a Z axis on the platform, wherein the at least one placement head is configured to suck and deliver the indium foils, and attach the indium foils on the substrates;
• at least one laser distance sensor disposed on the platform, wherein the at least one laser distance sensor is configured to measure a reference height of the placement head without carrying any indium foils, and a detecting height of the placement head after the placement head performs an indium foil suction operation;
• and
• a controller signally connected to the at least one laser distance sensor, wherein the controller is configured to receive the reference height and the detecting height, and determine whether an indium foil number sucked by the placement head during the indium foil suction operation is abnormal based on a difference between the reference height and the detecting height.