Embossed structure
AssigneeLignum Technologies AG
InventorHermann GFÖLLER
Life of this patent
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Abstract
A panel, in particular wall, ceiling, furniture or floor panel, wherein the panel comprises: a carrier plate, such as a medium density fiber (MDF) plate, a high density fiber (HDF) plate or a particle plate; wherein the plate has an embossed structure on its main surface, wherein the embossed structure comprises one or more three-dimensional structures extending at least partially into the plate; and at least one lacquer layer applied on the embossed structure.
Claims24
A panel, in particular wall, ceiling, furniture or floor panel, wherein the panel comprises:
- a carrier plate, such as a medium density fiber (MDF) plate, a high density fiber (HDF) plate or a particle plate;
- wherein the plate has an embossed structure on its main surface, wherein the embossed structure comprises one or more three-dimensional structures extending at least partially into the plate;
- and
- at least one lacquer layer applied on the embossed structure.
A method for manufacturing a panel, in particular wall, ceiling, furniture or floor panel, comprising the following steps:
- providing a carrier plate, such as a medium density fiber (MDF) plate or a high density fiber (HDF) plate or a particle plate;
- embossing the plate using an embossing structure, such as an embossing roller, for providing the plate with an embossed structure on its main surface, wherein the embossed structure comprises one or more three-dimensional structures extending at least partially into the plate;
- applying, after embossing the plate, at least one lacquer layer on the embossed structure.
Dependencies are inferred from the claim text.