Thermal print head, thermal print system, and method of manufacturing thermal print head
AssigneeRohm Co., Ltd.
InventorGoro NAKATANI
Life of this patent
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Abstract
A thermal print head includes a substrate, a first insulating film, and a second insulating film. The substrate has a first main surface and a second main surface opposite to the first main surface. A protruding portion protruding toward a side opposite to the second main surface is formed at the first main surface. A recessed portion is formed in a surface of the protruding portion. The first insulating film is disposed on the first main surface to cover the protruding portion. The second insulating film is disposed on the surface with the first insulating film interposed therebetween. A through hole is formed in a portion of the first insulating film that faces a bottom surface of the recessed portion with a space interposed therebetween.
Claims11
A thermal print head comprising:
- a substrate;
- a first insulating film;
- and
- a second insulating film, wherein
- the substrate has a first main surface and a second main surface opposite to the first main surface,
- a protruding portion protruding toward a side opposite to the second main surface is formed at the first main surface,
- a recessed portion is formed in a surface of the protruding portion,
- the first insulating film is disposed on the first main surface to cover the protruding portion,
- the second insulating film is disposed on the surface with the first insulating film interposed therebetween, and
- a through hole is formed in a portion of the first insulating film, the portion facing a bottom surface of the recessed portion with a space interposed therebetween.
A method of manufacturing a thermal print head, the method comprising:
- preparing a substrate having a first main surface and a second main surface opposite to the first main surface;
- forming, on the first main surface, a protruding portion protruding toward a side opposite to the second main surface;
- forming a first insulating film to cover a surface of the protruding portion;
- forming a through hole in a portion of the first insulating film located on the surface;
- forming a recessed portion in the surface by etching through the through hole;
- and
- forming a second insulating film on the first main surface with the first insulating film interposed therebetween, wherein
- the etching is isotropic dry etching.
Dependencies are inferred from the claim text.