Shaping method, shaping apparatus, and article manufacturing method

A shaping apparatus which performs, for each of a plurality of regions on a substrate, a process of curing a composition on the substrate while keeping a mold in contact with the composition and shapes the composition on the substrate by separating the mold from the cured composition, comprising:

• a supplier configured to supply, between the mold and the substrate, a gas lower in oxygen concentration than air;
• and
• a controller configured to control the process,
• wherein the plurality of regions include a first region that does not include an outer edge portion of the substrate and a second region that includes the outer edge portion of the substrate,
• wherein the composition on the substrate has a property of being inhibited from being cured by oxygen,
• wherein a gas supplying operation of supplying the gas by the supplier is controlled in the process before the mold is brought into contact with the composition on the substrate, and
• wherein the controller is configured to control the gas supplying operation in the process for the second region such that the supply amount of the gas becomes smaller than in the gas supplying operation in the process for the first region.

A shaping apparatus which performs, for each of a plurality of regions on a substrate, a process of curing a composition on the substrate while keeping a mold in contact with the composition and shapes the composition on the substrate by separating the mold from the cured composition, comprising:

• a supplier configured to supply, between the mold and the substrate, a gas lower in oxygen concentration than air;
• and
• a controller configured to control the process,
• wherein the plurality of regions include a first region that does not include an outer edge portion of the substrate and a second region that includes the outer edge portion,
• wherein the composition on the substrate has a property of being inhibited from being cured by oxygen, and
• wherein the controller is configured to control the supplier such that an oxygen concentration around the second region at the time of curing the composition on the second region becomes higher than an oxygen concentration around the first region at the time of curing the composition on the first region.