Substrate processing apparatus using supercritical fluid

Abstract

A substrate processing apparatus includes a first chamber in which a developing solution treatment process is performed, a second chamber in which a drying process is performed using a supercritical fluid, and a controller configured to control the first chamber and the second chamber, wherein the controller controls a first substrate to be placed in the first chamber, performs first cleaning on a processing space of the second chamber by using a supercritical fluid having a first state which does not satisfy a set condition, performs a developing solution treatment process on the first substrate placed in the first chamber, transfers the first substrate, on which the developing solution treatment process has been performed, from the first chamber to the second chamber, and performs a first drying process on the first substrate by using a supercritical fluid having a second state that satisfies the set condition.

Dependencies are inferred from the claim text.