# US 2026/0206594 A1 · Magnetic shield structure for chip > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0206594 A1 - Document ID: US20260206594A1 - Status: Published application - Kind: A1 - Application number: 19/017,904 - Filed: 2025-01-13 - Published: 2026-07-16 - Earliest claimed: 2025-01-13 - Assignees: GlobalFoundries U.S. Inc. - Applicants: GlobalFoundries U.S. Inc. - Inventors: Abhishek Talapatra; Clarissa Cyrilla Prawoto; Vinayak Bharat Naik - Web page: https://patentgrep.com/patent/US20260206594A1 ## CPC - H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00) - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - G11C 5/005: {Circuit means for protection against loss of information of semiconductor storage devices} - G11C 11/1695: {Protection circuits or methods} - H05K 9/0075: {Magnetic shielding materials} - H10W 70/63: Vias, e.g. via plugs - H10W 70/69: Insulating materials thereof - H10W 72/072: {of bump connectors} - H10W 76/12: characterised by their shape - H10W 76/15: Containers comprising an insulating or insulated base - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10B 61/00: Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G11C: STATIC STORES (semiconductor memory devices H10B) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10B: ELECTRONIC MEMORY DEVICES ## Abstract Disclosed are embodiments of structure including: a chip with an embedded magnetic random access memory (eMRAM) or other on-chip component susceptible to magnetic field-induced performance degradation; and magnetic shield(s) for protecting the chip. In some embodiments, a magnetic shield includes abutting magnetic layers having different magnetic properties. In other embodiments, a magnetic shield includes abutting magnetic layers (of the same or different magnetic materials) having offset patterns of openings (e.g., through-holes or mesh). In any case, the chip can be mounted on a board and contained in a package. Such magnetic shields can be located on the package (opposite the board) and/or on the board (opposite the chip) depending upon the expected location of a potentially adverse magnetic field. ## Claims ### Claim 1 A structure comprising: a chip; and a magnetic shield adjacent to the chip, wherein the magnetic shield includes: a first magnetic layer; and a second magnetic layer abutting the first magnetic layer and further having different magnetic properties than the first magnetic layer. ### Claim 2 (depends on 1) The structure of claim 1, wherein the first magnetic layer has a first magnetic permeability and first magnetic saturation, and wherein the second magnetic layer has a second magnetic permeability different from the first magnetic permeability and a second magnetic saturation different from the first magnetic saturation. ### Claim 3 (depends on 2) The structure of claim 2, wherein the magnetic shield further includes: at least one additional magnetic layer including a third magnetic layer abutting the second magnetic layer opposite the first magnetic layer, and wherein the third magnetic layer has a third magnetic permeability different from the first magnetic permeability and the second magnetic permeability and further has a third magnetic saturation different from the first magnetic saturation and the second magnetic saturation. ### Claim 4 (depends on 3) The structure of claim 3, wherein the first magnetic layer is proximal to the chip and the third magnetic layer is distal to the chip, wherein the first magnetic permeability, the second magnetic permeability, and the third magnetic permeability any of increase and decrease progressively. ### Claim 5 (depends on 3) The structure of claim 3, wherein the first magnetic layer is proximal to the chip and the third magnetic layer is distal to the chip, and wherein the second magnetic permeability is one of higher and lower than the first magnetic permeability and the third magnetic permeability. ### Claim 6 (depends on 1) The structure of claim 1, further including: a board, wherein the chip is contained within a package and mounted on the board. ### Claim 7 (depends on 6) The structure of claim 6, wherein the magnetic shield abuts the package opposite the board. ### Claim 8 (depends on 7) The structure of claim 7, further comprising an additional magnetic shield abutting the board opposite the chip. ### Claim 9 (depends on 6) The structure of claim 6, wherein the magnetic shield abuts the board opposite the chip. ### Claim 10 (depends on 1) The structure of claim 1, wherein the chip includes an embedded magnetic random access memory and wherein the magnetic shield boosts magnetic immunity of the embedded magnetic random access memory from an adjacent magnetic field. ### Claim 11 A structure comprising: a chip; and a magnetic shield adjacent to the chip, wherein the magnetic shield includes: a first magnetic layer; and a second magnetic layer abutting the first magnetic layer, wherein the first magnetic layer and the second magnetic layer have offset patterns of openings. ### Claim 12 (depends on 11) The structure of claim 11, wherein the first magnetic layer and the second magnetic layer have any of the same magnetic properties and different magnetic properties. ### Claim 13 (depends on 11) The structure of claim 11, wherein the first magnetic layer has first through-holes and the second magnetic layer has second through-holes that are completely offset from the first through-holes. ### Claim 14 (depends on 13) The structure of claim 13, wherein the magnetic shield further includes: a third magnetic layer abutting the second magnetic layer opposite the first magnetic layer and further having third through-holes completely offset from the first through-holes and the second through-holes. ### Claim 15 (depends on 13) The structure of claim 13, wherein any of shapes, sizes, and numbers of the first through-holes and the second through-holes are different. ### Claim 16 (depends on 11) The structure of claim 11, further including: a board, wherein the chip is contained within a package and mounted on the board. ### Claim 17 (depends on 16) The structure of claim 16, wherein the magnetic shield abuts the package opposite the board. ### Claim 18 (depends on 17) The structure of claim 17, further comprising an additional magnetic shield abutting the board opposite the chip. ### Claim 19 (depends on 16) The structure of claim 16, wherein the magnetic shield abuts the board opposite the chip. ### Claim 20 A structure comprising: a chip; a board, wherein the chip is contained within a package and mounted on the board; a first magnetic shield abutting the package opposite the board; and a second magnetic shield abutting the board opposite the chip, wherein the first magnetic shield and the second magnetic shield each include at least: a first magnetic layer; and a second magnetic layer abutting the first magnetic layer, and wherein the first magnetic layer and the second magnetic layer have any different magnetic properties and offset patterns of openings.