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US 2026/0206352 A1Published application
Image sensor packages and related methods
AssigneeSemiconductor Components Industries, LLC
InventorShou-Chian HSU
Life of this patent
Estimating the term…
Abstract
An image sensor package may include an image sensor semiconductor die including at least one pad; a carrier die including a through silicon via; and an optically transmissive cover bonded to the image sensor semiconductor die. The through silicon via may be bonded to the at least one pad. The carrier die may include only electrical connectors.
Claims20
An image sensor package comprising:
- an image sensor semiconductor die comprising at least one pad;
- a carrier die comprising a through silicon via;
- and
- an optically transmissive cover bonded to the image sensor semiconductor die;
- wherein the through silicon via is bonded to the at least one pad;
- and
- wherein the carrier die comprises only electrical connectors.
4 more elements
A method of forming an image sensor package, the method comprising:
- providing a semiconductor substrate;
- providing a carrier substrate;
- forming a plurality of through silicon vias in the carrier substrate;
- forming a dielectric layer on the carrier substrate;
- forming a plurality of via pads, each via pad of the plurality of via pads on each through silicon via of the plurality of through silicon vias;
- forming a device layer on the semiconductor substrate, the device layer comprising a plurality of interconnect pads;
- bonding the carrier substrate to the semiconductor substrate at the plurality of via pads and plurality of interconnect pads;
- thinning the semiconductor substrate to a desired thickness;
- bonding an optically transmissive substrate over the semiconductor substrate;
- thinning the carrier substrate to the plurality of through silicon vias;
- forming electrical connectors on the carrier substrate to the plurality of through silicon vias;
- and
- singulating the semiconductor substrate, carrier substrate, and optically transmissive substrate to form a plurality of image sensor packages.
10 more elements
A method of forming an image sensor package, the method comprising:
- providing a carrier substrate;
- providing an image sensor substrate comprising a plurality of interconnect pads;
- forming a plurality of through silicon vias in the carrier substrate;
- forming a plurality of via pads, each via pad of the plurality of via pads on each through silicon via of the plurality of through silicon vias;
- bonding the carrier substrate to the image sensor substrate at the plurality of via pads and plurality of interconnect pads;
- thinning the image sensor substrate to a desired thickness;
- bonding an optically transmissive substrate over the image sensor substrate;
- thinning the carrier substrate to the plurality of through silicon vias;
- forming electrical connectors on the carrier substrate to the plurality of through silicon vias;
- and
- singulating the image sensor substrate, carrier substrate, and optically transmissive substrate to form a plurality of image sensor packages.
8 more elements
Dependencies are inferred from the claim text.