Accommodation module and electronic device including the same
AssigneeLanner Electronics Inc.
InventorYEN-YIN YU
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AssigneeLanner Electronics Inc.
InventorYEN-YIN YU
Estimating the term…
The present invention discloses an accommodation module for being integrated in a housing case of an electronic device. In an application of high-level device, the accommodation module comprises a lower layer accommodation unit and an upper layer accommodation unit, in which the two units are all able to receive N numbers of removable electronic modules. On the other hand, in an application of low-level device, a total number of the upper layer accommodation unit's accommodation spaces can be changed (reduced), thereby limiting the upper layer accommodation unit capable of merely receiving R(R<N) numbers of removable electronic modules. Further, in other applications, the accommodation spaces of the upper layer accommodation unit can also be rearranged, such that the upper layer accommodation unit is able to receive at least one PCIE expansion card and/or at least one removable electronic module.
An accommodation module for being integrated in a housing case of an electronic device, wherein a side plate of the housing case is provided with at least one first opening, and the accommodation module comprises a first accommodation unit, which comprises:
Dependencies are inferred from the claim text.