Metal Embedded RF Photonic Assembly For Compact Millimeter Wave Emitter Array

A method of manufacturing an optoelectronic emitter, the method comprising:

• providing a light detection wafer having first top and bottom surfaces, the light detection wafer comprising at least one photodetector chip arranged to receive light in an optical input on the first bottom surface, along a photodetector axis normal to the first bottom surface and to output an electrical signal from at least one signal output pad on the first top surface;
• providing an antenna wafer having a second bottom surface and having a second top surface, at least one antenna patch being arranged on the second top surface and being connected by at least one via to at least one bottom antenna pad on the second bottom surface;
• and
• attaching the second bottom surface to the first top surface such that said at least one bottom antenna pad is electrically coupled to the at least one signal output pad on the first top surface.