Bipolar transistor structure and radio frequency amplifier
AssigneeXiamen Sanan Integrated Circuit Co., Ltd.
InventorsZhangzhi CHEN, Zhiming LIAO, Xiangyang HE, Houngchi WEI, ChiaChu KUO
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AssigneeXiamen Sanan Integrated Circuit Co., Ltd.
InventorsZhangzhi CHEN, Zhiming LIAO, Xiangyang HE, Houngchi WEI, ChiaChu KUO
Estimating the term…
A semiconductor device includes a semiconductor layer, having a first surface, including sequentially stacked collector, base layer, and emitter layers, and the first surface being a surface of the emitter layer away from the base layer; an emitter mesa and an emitter electrode sequentially disposed on the emitter layer; an interlayer dielectric layer, at least partially covering the emitter electrode’s top surface, extending along its side surface to cover part of the first surface exposed outside the emitter electrode, and defining an opening; and a base electrode, connected to the base layer through the opening, and extending to cover at least part of the interlayer dielectric layer adjacent to the opening. A difference between a spacing D1 from the opening to the emitter mesa and a distance D2 between a part of the base electrode on the interlayer dielectric layer to the emitter mesa is 0.1-1 μm.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.