Metal Embedded RF Photonic Assembly For Compact Millimeter Wave Receiver Array

A method of manufacturing an optoelectronic receiver, the method comprising:

• providing a light source wafer having first top and bottom surfaces, the light source wafer comprising at least one laser chip arranged to emit a light beam along a beam axis normal to the first bottom surface and at least one associated via between a top pad on the first top surface and a bottom pad on the first bottom surface;
• attaching a second top surface of an optical modulation layer to the first bottom surface, said optical modulation layer having a second bottom surface and comprising at least one opto-electronic modulator having a second top surface optical input and a second top surface electrical input, and a second bottom surface optical output, such that the second top surface optical input receives the light beam from the at least one laser chip and the second top surface electrical input is electrically connected to the bottom pad on the first bottom surface.