Thin film capacitor, manufacturing method therefor, and electronic circuit board having the thin film capacitor

A method for manufacturing a thin film capacitor, the method comprising:

• roughening a main surface of a metal foil;
• forming a dielectric film on the main surface of the metal foil;
• forming a first opening in the dielectric film to partially expose the metal foil;
• providing a first insulating resin surrounding the first opening;
• forming, at an outside of a region surrounded by the first insulating resin, a conductive polymer layer contacting the dielectric film without contacting the metal foil;
• forming a second insulating resin covering a part of the conductive polymer layer and exposing another part of the conductive polymer layer through a second opening;
• and
• forming, in the region surrounded by the first insulating resin, a first metal layer electrically connected to the metal foil through the first opening and forming, on the second insulating resin, a second metal layer electrically connected to the conductive polymer layer through the second opening.

A method for manufacturing a thin film capacitor, the method comprising:

• roughening a main surface of a metal foil;
• forming a dielectric film on the main surface of the metal foil;
• forming a first opening in the dielectric film to partially expose the metal foil;
• forming a conductive polymer layer contacting the dielectric film without contacting the metal foil;
• forming, on the conductive polymer layer, an insulating resin having a second opening for exposing the conductive polymer layer and a third opening for exposing the metal foil through the first opening;
• and
• forming, on the insulating resin, a first metal layer electrically connected to the metal foil through the first and third openings and a second metal layer electrically connected to the conductive polymer layer through the second opening.