Chip packaging structure
AssigneeSES RFID Solutions GmbH
InventorsSHAO-LUN LIAW, YU-CHENG LI
Life of this patent
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Abstract
A chip packaging structure is provided and includes a first antenna, a radio frequency identification chip, a sensing unit and a packaging member. The radio frequency identification chip is electrically connected to the first antenna. The sensing unit is electrically connected to the radio frequency identification chip. The packaging member is adapted to encapsulate the first antenna and the radio frequency identification chip and at least partially encapsulate the sensing unit. The sensing unit is configured to sense a physical parameter of an environment and generate a sensing signal to the radio frequency identification chip, and the radio frequency identification chip is configured to transmit the sensing signal via the first antenna.
Claims20
A chip packaging structure, comprising:
- a first antenna;
- a radio frequency identification chip electrically connected to the first antenna;
- a sensing unit electrically connected to the radio frequency identification chip;
- a packaging member adapted to encapsulate the first antenna and the radio frequency identification chip and at least partially encapsulate the sensing unit;
- wherein the sensing unit is configured to sense a physical parameter of an environment and generate a sensing signal to the radio frequency identification chip, and the radio frequency identification chip is configured to transmit the sensing signal via the first antenna.
Dependencies are inferred from the claim text.