Flip-type film sticking device for electronic device

Abstract

A flip-type film sticking device for an electronic device is disclosed. The flip-type film sticking device includes an installation box for placing the electronic device; an installation slot is formed in the installation box for accommodating the electronic devices; one side of the installation box is flexibly connected with a cover for installing a film sticking assembly and engaging with the installation box; a receiving slot is formed in the cover for accommodating the film sticking assembly; by installing the cover on one side of the installation box, the film sticking assembly is installed onto the cover, replacing the existing method of placing the film sticking assembly directly in the installation box. Before the film is attached, there is no need to first attach the electronic device to the film sticking assembly.

Dependencies are inferred from the claim text.