US 2026/0202823 A1 · Multifaceted Thermal-Response Shaping

Abstract

Techniques and apparatuses are described for implementing multifaceted thermal-response shaping. In example aspects, a thermal control system manages heat that is generated by a subsystem of a system-on-chip to protect the subsystem from being damaged due to overheating, to maintain reliability of the system-on-chip, and to avoid creating a potentially unsafe situation for the user to operate a computing device with the system-on-chip. The thermal control system triggers the subsystem to operate at different operation points to shape a thermal response of the system-on-chip. The thermal control system appropriately shapes the thermal response based on an evaluation of two or more metrics, such as temperature and power, which can be associated with similar or different time scales. With this flexible, multifaceted approach, the thermal control system can determine an operation point that can improve the user experience and does not compromise a safety or reliability of the subsystem.

Claims20

Dependent claims

A method performed by a system-on-chip, the method comprising:

operating, during a first time interval, a subsystem of the system-on-chip at a first operation point;
determining, during the first time interval, a second operation point based on a first feedback metric of multiple feedback metrics associated with the subsystem;
operating, during a second time interval, the subsystem of the system-on-chip at the second operation point;
determining a third operation point based on a second feedback metric of the multiple feedback metrics associated with the subsystem, the second feedback metric being different from the first feedback metric;
and
operating, during a third time interval, the subsystem of the system-on-chip at the third operation point.

3 more elements

A method performed by a system-on-chip, the method comprising:

operating, during a first time interval, a subsystem of the system-on-chip at a first operation point;
determining, during the first time interval, a first candidate operation point based on a measured temperature of the subsystem;
determining, during the first time interval, a second candidate operation point based on a measured power metric of the subsystem;
selecting one of the first candidate operation point or the second candidate operation point as a second operation point;
and
operating, during a second time interval, the subsystem of the system-on-chip at the second operation point.

3 more elements

A system-on-chip comprising:

at least one subsystem configured to:
operate at a first operation point during a first time interval;
and
operate at a second operation point during a second time interval;
and
at least one thermal control system coupled to the at least one subsystem and configured to:
determine, during the first time interval, a first candidate operation point based on a measured temperature of the subsystem;
determine, during the first time interval, a second candidate operation point based on a measured power metric of the subsystem;
select one of the first candidate operation point or the second candidate operation point as the second operation point;
and
cause the at least one subsystem to operate at the second operation point during the second time interval.

8 more elements

Dependencies are inferred from the claim text.

Multifaceted Thermal-Response Shaping

Life of this patent

Multifaceted Thermal-Response Shaping

Life of this patent

Abstract

Claims20