Systems and methods for isolating faults in die-to-die interconnects

A method for isolating faults in an arrangement of dies comprising a first die coupled to a second die via a die-to-die interconnect, the method comprising:

• providing a first transmission path, along the die-to-die interconnect, from a transmitter associated with the first die to an asynchronous buffer associated with the second die;
• providing a second transmission path from voltage reference circuitry associated with the second die to the asynchronous buffer associated with the second die, wherein the voltage reference circuitry is configured to selectively output a first voltage or a second voltage, different from the first voltage;
• and
• simultaneously enabling both the first transmission path and the second transmission path to allow the asynchronous buffer to receive inputs from both the transmitter associated with the first die and the voltage reference circuitry associated with the second die, such that the inputs received by the asynchronous buffer are indicative of:
• (1) no failure in the die-to-die interconnect, (2) an open failure in the die-to-die interconnect, or (3) a short failure in the die-to-die interconnect.

A system comprising:

• a first die coupled to a second die via a first die-to-die interconnect and a second die-to-die interconnect;
• a first transmission path, along the first die-to-die interconnect, from a first transmitter associated with the first die to a first asynchronous buffer associated with the first die;
• a second transmission path, along the second die-to-die interconnect, from a second transmitter associated with the second die to a second asynchronous buffer associated with the second die;
• a third transmission path from first voltage reference circuitry associated with the first die to the first asynchronous buffer associated with the first die and a fourth transmission path from second voltage reference circuitry associated with the second die to the second asynchronous buffer associated with the second die, wherein each of the first voltage reference circuitry and the second voltage reference circuitry is configured to selectively output a first voltage or a second voltage, different from the first voltage;
• and
• control circuitry configured to simultaneously enable the first transmission path, the second transmission path, the third transmission path, and the fourth transmission path in order to detect any neighbor short between the first die-to-die interconnect and the second die-to-die interconnect based on inputs received by the first asynchronous buffer and the second asynchronous buffer.