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US 2026/0202307 A1Published application
Sensing device and method for manufacturing the same
AssigneeIndustrial Technology Research Institute
InventorsTseng-Huang LIU, Yi-Chau HUANG, Chia-Ying TANG
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Abstract
The present disclosure provides a sensing device. The sensing device includes a substrate, a protective layer and a hole. The substrate has an upper surface. The protective layer is disposed on the substrate and contacts the upper surface. The hole penetrates the protective layer and a portion of the substrate.
Claims30
A sensing device comprising:
- a substrate having an upper surface;
- a protective layer disposed on the substrate and contacting the upper surface;
- and
- a hole penetrating the protective layer and a portion of the substrate.
1 more element
A sensing device comprising:
- a substrate having an upper surface;
- a protective layer disposed on the substrate and contacting the upper surface;
- a passivation layer disposed on the protective layer;
- and
- a hole penetrating the passivation layer, the protective layer and a portion of the substrate.
2 more elements
A method for manufacturing a sensing device, comprising:
- providing a substrate having an upper surface;
- forming a protective layer on the upper surface, and the protective layer contacting the upper surface;
- forming a passivation layer on the protective layer;
- and
- forming a hole penetrating the passivation layer, the protective layer and a portion of the substrate.
2 more elements
Dependencies are inferred from the claim text.