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US 2026/0202225 A1Published application
Sensor Module
AssigneeSeiko Epson Corporation
InventorRyohei OZAWA
Life of this patent
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Abstract
A sensor module including a base and a lid constituting a housing, a sensor substrate that is disposed in the housing and on which a first sensor is mounted, two or more fixing members that fix the sensor substrate to the base, and a filling member that covers the sensor substrate and the two or more fixing members and with which a portion between the sensor substrate and the housing is filled.
Claims9
A sensor module comprising:
- a base and a lid constituting a housing;
- a sensor substrate that is disposed in the housing and on which a first sensor is mounted;
- two or more fixing members that fix the sensor substrate to the base;
- and
- a filling member that covers the sensor substrate and the two or more fixing members and with which a portion between the sensor substrate and the housing is filled.
2 more elements
Dependencies are inferred from the claim text.