US 2026/0202144 A1 · HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREFOR

Abstract

The present invention relates to a heat dissipation device and a manufacturing method therefor. The heat dissipation device according to the present invention includes a heat-conduction panel body in which a refrigerant flow space having a predetermined thickness is formed to dissipate heat through a first surface and a second surface, wherein the heat-conduction panel body comprises a vacuumization portion installed on either the first surface or the second surface to communicate with the refrigerant flow space in a direction perpendicular thereto, the vacuumization portion being configured to vacuumize the refrigerant flow space before a refrigerant is filled into the refrigerant flow space or after the refrigerant is filled therein. Thus, there are the advantages of preventing a refrigerant leak in the heat dissipation device and improving heat dissipation performance.

Claims20

Dependent claims

A heat dissipation device comprising:

a heat-conduction panel body in which a refrigerant flow space having a predetermined thickness is formed to dissipate heat through a first surface and a second surface,
wherein the heat-conduction panel body comprises a vacuumization portion installed on either the first surface or the second surface to communicate with the refrigerant flow space in a direction perpendicular thereto, the vacuumization portion being configured to vacuumize the refrigerant flow space before a refrigerant is filled into the refrigerant flow space or after the refrigerant is filled therein.

A method of manufacturing a heat dissipation device, the method comprising:

a heat-conduction panel body sheet-metal forming process of machining a first side heat-conduction panel and a second side heat-conduction panel that define a refrigerant flow space therein, and integrally forming, in either the first side heat-conduction panel or the second side heat-conduction panel, an air vent hole for refrigerant filling or vacuumization;
after the heat-conduction panel body sheet-metal forming process, a joining process of joining the first side heat-conduction panel and the second side heat-conduction panel to each other to form the refrigerant flow space, wherein the first and second side heat-conduction panels are formed of either a single metal panel member or two metal panel members;
and
after the joining process, a vacuumization process of vacuumizing the refrigerant flow space,
wherein the vacuumization process comprises a vacuumization-portion installation operation of installing a vacuumization portion in the air vent hole.

2 more elements

Dependencies are inferred from the claim text.

Heat dissipation device and manufacturing method therefor

Life of this patent

Heat dissipation device and manufacturing method therefor

Life of this patent

Abstract

Claims20