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US 2026/0201655 A1Published application
Floor pavement structure with passive temperature control
AssigneeApt Asia Pacific Pty. Ltd.
InventorsJames Michael TRITT, Sumeet LUDDU, Robert CORBO
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Abstract
A floor pavement structure exhibiting resistance to overheating, the floor pavement structure comprising at least one heat conductive sub-layer including graphite, graphene or combinations thereof, the heat conductive sub-layer being disposed between a top layer and a substrate. The top layer may include a phase change material.
Claims15
A floor pavement structure comprising:
- a top layer,
- a plurality of sub-layers comprising at least one heat conductive sub-layer comprising a heat conductive material,
- wherein the plurality of sub-layers are disposed between the top layer and a substrate.
A method of constructing a floor pavement structure, the method comprising:
- applying a first reaction mixture comprising a heat conductive material dispersed therein on top of a substrate and letting the applied reaction mixture to form a heat conductive sub-layer;
- and
- after the formation of the heat conductive sub-layer, forming a top layer over the heat conductive sub-layer,
- wherein the heat conductive material comprises graphite, graphene or a combination thereof.
1 more element
Dependencies are inferred from the claim text.