Method and a Substrate Processing Apparatus for Forming an Epitaxial Stack on a Plurality of Substrates
AssigneeASM IP Holding B.V.
InventorRami Khazaka
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AssigneeASM IP Holding B.V.
InventorRami Khazaka
Estimating the term…
A method for forming an epitaxial stack on a plurality of substrates comprises providing a plurality of substrates to a process chamber and executing deposition cycles, wherein each deposition cycle comprises a first deposition pulse and a second deposition pulse. The epitaxial stack comprises a first epitaxial layer stacked alternatingly and repeatedly with a second epitaxial layer, the second epitaxial layer being different from the first epitaxial layer. The first deposition pulse comprises a provision of a first reaction gas mixture to the process chamber, thereby forming the first epitaxial layer having a first native lattice parameter. The second deposition pulse comprises a provision of a second reaction gas mixture to the process chamber, thereby forming the second epitaxial layer having a second native lattice parameter, wherein the first native lattice parameter lies in a range within 1.5% larger than and 0.9% smaller than the second native lattice parameter.
A method of forming an epitaxial stack on a plurality of substrates to enhance etch selectivity between a first epitaxial layer and a second epitaxial layer;
A method of forming an epitaxial stack on a plurality of substrates;
A substrate processing apparatus for forming an epitaxial stack on a plurality of substrates, the apparatus comprising:
Dependencies are inferred from the claim text.