Back to results
US 2026/0201276 A1Published application
Cleaning composition and method of fabricating semiconductor device using the same
AssigneeDongwoo Fine-Chem Co., Ltd.
InventorsJONG WOOK BAEK, GI WOO LEE, DONG GYU LEE
Life of this patent
Estimating the term…
Abstract
A cleaning composition includes a cyclic amide-based compound, a polar aprotic solvent, and a fluorine-based compound. The cleaning composition can rapidly remove a silicon-based polymer without generating residue and etching a metal layer. The cleaning composition can be used for a cleaning process of a wafer in a fabrication of a semiconductor device.
Claims13
A cleaning composition comprising:
- a fluorine-based compound;
- an organic acid salt compound;
- an inorganic acid compound;
- and
- water,
- wherein a content of water is at least 50 wt % based on a total weight of the composition, and the cleaning composition has a pH of 0.5 to 4.
3 more elements
Dependencies are inferred from the claim text.