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US 2026/0201236 A1Published application
Surface-modified ceramic particles and heat dissipating epoxy resin composition including the same
AssigneeKorea Basic Science Institute
InventorsGaehang LEE, Yechan CHANG
Life of this patent
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Abstract
The present disclosure relates to a surface-modified ceramic particle including a ceramic particle and a modifying metal ion bonded to a surface of the ceramic particle. The present disclosure further relates to a heat dissipating epoxy resin composition including the surface-modified ceramic particles, and a heat dissipating cured product manufactured therefrom.
Claims20
A surface-modified ceramic particle comprising:
- a ceramic particle;
- and
- a modifying metal ion bonded to a surface of the ceramic particle.
A method for manufacturing surface-modified ceramic particles, the method comprising:
- including a modifying metal ion precursor in a solvent to prepare a solution;
- and
- including the solution and ceramic particles to manufacture surface-modified ceramic particles.
Dependencies are inferred from the claim text.