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US 2026/0201201 A1Published application
Curable resin composition and processed article thereof
AssigneeThreebond Co., Ltd.
InventorsFumiya NAKAMURA, Tetsunori SOGA, Masayuki NIWA, Kuniyasu ASAI, Tomohiro ONODA
Life of this patent
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Abstract
A curable resin composition contains components (A) to (D). Component (A) is a capsule filled with a polyfunctional epoxy resin and a monofunctional epoxy resin as an inclusion. Component (B) is a capsule filled with a polythiol as an inclusion. Component (C) is a compound to promote curing of the inclusion of the component (A) with the inclusion of the component (B). Component (D) is an inorganic filler.
Claims10
A curable resin composition comprising the following components (A) to (D):
- component (A):
- a capsule filled with a polyfunctional epoxy resin and a monofunctional epoxy resin as an inclusion;
- component (B):
- a capsule filled with a polythiol as an inclusion;
- component (C):
- a compound to promote curing of the inclusion of the component (A) with the inclusion of the component (B);
- and
- component (D):
- an inorganic filler.
6 more elements
Dependencies are inferred from the claim text.