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US 2026/0201148 A1Published application
Resin composition and heat dissipation member
AssigneeSekisui Chemical Co., Ltd.
InventorsRyousuke TAKAHASHI, Takahiro URAYAMA, Yuuto KAGE, Osamu INUI, Hidehito NISHIZAWA, Tetsuro YOSHIOKA, Motohiko ASANO
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Abstract
There is provided a resin composition including a resin having an alkyl group on a side chain of a molecule thereof, an inorganic filler and an antioxidant, wherein the antioxidant is either of a hydrazide-based antioxidant or a combination of a hindered phenol-based antioxidant and an organic metal chelate-based antioxidant.
Claims7
A resin composition, comprising:
- a matrix resin, an inorganic filler and an antioxidant, the antioxidant being either of a hydrazide-based antioxidant or a combination of a hindered phenol-based antioxidant and a chelate-based antioxidant.
Dependencies are inferred from the claim text.