Resin additive, composition, molded article and compound

Abstract

An object of the present invention is to provide an additive for resin that has excellent thermal resistance and excellent resin stabilization performance. The present invention relates to an additive for resin containing a compound represented by the general formula (1) below. In the general formula (1), R1 represents an alkyl group having 26 to 40 carbon atoms, an alkenyl group having 26 to 40 carbon atoms, or a group represented by the general formula (2) below, where n represents an integer of 1 or 2. When n is 2, the groups R1 may be the same or different. In the general formula (2), R2 represents hydrogen or an alkyl group having 1 to 18 carbon atoms, m represents an integer that results in a number-average molecular weight of 100 to 10,000 for the group represented by the general formula (2), and * represents a bond.

Dependencies are inferred from the claim text.