Resin, resin composition, cured layer and etching method
AssigneeAdvanced Echem Materials Company Limited
InventorsYu-Chen Chiu, Ting-Ruei Xu, Yun-Ju Chiang, Hsiang-Lin Hsu, Zhi-Jie Yang, Wei-Chung Liang, Cheng-Ying Hsieh
Life of this patent
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Abstract
A resin, a resin composition, a cured layer and an etching method are provided. The resin includes a structural unit represented by the following Formula (A). In the resin, an amount of the propynyl group is not zero. Among the hydrogen and the propynyl group represented by R1 and R2, a molar ratio of the hydrogen and the propynyl group is 90:10 to 55:45. In Formula (A), R1 and R2 each represent hydrogen or propynyl group, and * represents a bonding position.
Claims12
A resin, comprising a structural unit represented by the following Formula (A):
- in Formula (A), R1 and R2 each represent hydrogen or a propynyl group, * represents a bonding position,
- wherein in the resin, a content of the propynyl group is not 0,
- among the hydrogen and the propynyl group represented by R1 and R2, a molar ratio of hydrogen to a propynyl group is 90:10 to 55:45.
Dependencies are inferred from the claim text.