Solid wood grain pad structure and method of manufacturing the same

Abstract

A solid wood grain pad structure comprises: a protective layer, a first adhesive layer, an adhesive adhesion undercoat layer, a first pattern effect layer, a UV-sealing coating layer, a natural plant epidermis layer, a second adhesive layer, a first thermal conductive layer, a third adhesive layer, a filling sheet interlayer, a fourth adhesive layer, and a second thermal conductive layer, which are sequentially disposed from top to bottom; and a base sealing resin adhesive edge-banding layer surroundingly adhered to surface layers around outer vertical sides of a pad base. By virtue of physical properties and structural matching of materials of respective layers, while achieving a natural temperature control through a physical means, the present invention really well addresses prominent problems of the solid wood grain coaster panel, such as adhesive layer delamination and base deformation, thereby extending the lifetime of the solid wood grain coaster panel.

Dependencies are inferred from the claim text.